Showing 1 - 25 of 986 Results
2.
Classical Chinese Literature An Anthology of Translations From Antiquity to the Tang Dynasty by Minford, John, Lau, Joseph ... ISBN: 9780231096768 List Price: $110.00
3.
Husserls Logical Investigations in the New Century: Western and Chinese Perspectives (Contri... by Lau, Kwok-Ying, Drummond, J... ISBN: 9789048174409 List Price: $115.00
5.
Through-Silicon Vias for 3D Integration by John Lau ISBN: 9780071785143 List Price: $150.00
7.
The Speculations On Metaphysics, Polity, And Morality Of The Old Philosophe, Lau-Tsze (1868) by Lao-Tsze, Chalmers, John ISBN: 9781165890385 List Price: $14.36
8.
Electronics Manufacturing With Lead-Free, Haogen Free, and Conductive Adhesive Materials by Lau, John H., Wong, C. P., ... ISBN: 9780071386241 List Price: $125.00
9.
Erasmus Stultitiae Laus by Collins, John F. ISBN: 9780929524719 List Price: $13.95
10.
Classical Chinese Literature : An Anthology of Translations by Minford, John, Lau, Joseph ... ISBN: 9789629960483
11.
Speculations on Metaphysics, Polity, and Morality of the Old Philosophe, Lau-Tsze by Lao-Tsze, Chalmers, John ISBN: 9781168936301 List Price: $26.36
12.
Speculations on Metaphysics, Polity and Morality of the Old Philosopher Lau Tsze by Lau-Tsze, Chalmers, John ISBN: 9781169843578 List Price: $32.95
14.
Thermal Stress and Strain in Microelectronics Packaging by Lau, John H. ISBN: 9780442010584 List Price: $99.95
15.
Hydrology of the Hawaiian Islands by Lau, L. Stephen, Mink, John F. ISBN: 9780824829483 List Price: $61.00
17.
Electronic Packaging Design, Materials, Process, and Reliability by Lau, John H., Nakayama, Wat... ISBN: 9780070371354 List Price: $69.00
18.
Chip Scale Packaging Design, Materials, Processes and Realiablity, and Applications by Lau, John H., Lee, S. W. Ricky ISBN: 9780070383043 List Price: $89.50
19.
Solder Joint Reliability of Bga, Csp, Flip Chip, and Fine Pitch Smt Assemblies by Lau, John H., Pao, Yi-Hsin ISBN: 9780070366480 List Price: $65.00
20.
Fan-Out Wafer-Level Packaging by Lau, John H. ISBN: 9789811088834 List Price: $199.99
21.
Ball Grid Array Technology by Lau, John H. ISBN: 9780070366084 List Price: $85.00
23.
100 green SPACES by Johann Redl, Julia Riefenst... ISBN: 9783903269613
24.
Flip Chip Technologies by Lau, John H. ISBN: 9780070366091 List Price: $89.00
25.
Ma`afu, prince of Tonga, chief of Fiji: The life and times of Fiji's first Tui Lau by John Spurway ISBN: 9781925021172 List Price: $40.00
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